Vol. 2 - August 2004
What can VisionGauge® products do for you?
Read examples of applications that VisionGauge® machine vision products have successfully solved!
Laser Triangulation Systems to Measure Automotive Sealant Bead Height & Width
VISIONx developed a laser triangulation system to measure the width & height of a sealant bead used in the automotive industry to affix windshields in cars. These laser triangulation systems include a high-resolution camera as well as a LASER oriented at 45 degrees relative to the camera’s optical centerline. The LASER projects a very thin and straight line at the point of measurement. By measuring the LASER line’s offset across the camera’s field-of-view, the system can automatically measure, very accurately, the height of the sealant.
Note: The laser measurements are being carried out as the sealant bead is still un-cured, and thus "gelatinous". Only over time will it become solid.
View our Laser Profiling Systems
High-Speed Measurements of Machined Mechanical Components
VisionGauge® OnLine is being used to carry out different types of measurements on various
machined mechanical components. These high-speed
measurements are either carried out in-process, in which case 100% of the production is typically checked; or off-line, in which case only a sampling of parts is periodically tested.
Note that in addition to carrying out various types of general measurements, VisionGauge® OnLine can also be used to ensure that no burrs and other similar defects are present.
As production changes, VisionGauge® OnLine can easily be re-programmed to accommodate new part geometries. Part programs can be saved to disk and read back in later on. There are no limits on the number of parts that VisionGauge® OnLine can support.
In-Process Component Placement and Epoxy Underfill Verification
VisionGauge® OnLine can easily be configured to carry out in-process component placement verification (i.e. verify presence, position and orientation) in the semiconductor industry. Furthermore, VisionGauge® OnLine can also verify the presence of epoxy underfill, used to bond the chip to the substrate. Such a system can easily deal with throughputs of many hundreds of parts per minute.
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