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Wire bonding is the most common
method used for interconnection inside many integrated circuits and
microchips. It is a delicate process that requires high accuracy.
VisionGaugeŽ Online Automated Optical Inspection Systems
(AOI Systems) can inspect wire bond connections and
perform high-accuracy measurements on them.
Our AOI systems can be configured
with high magnification optics and reliably provide measurements in
micron range, making it a perfect system for microchip inspection or wire bond
inspection. Additionally, our systems are fully capable of
producing repeatable motions in three dimensions which allows you to
measure objects that extend outside of the camera's Field-of-View and
position your parts accurately.
These inspection systems are
fully programmable with the aid of our easy-to-use VisionGaugeŽ
Online machine vision software. There are numerous features
in the software to facilitate your inspection, and with our custom
inspection systems you can be sure our product will work for
your applications.
With highly customizable systems
that can learn how to perform an inspection for you, control input and
output signals, and create user-defined reports, the VisionGaugeŽ
Online Automated Optical Inspection Systems (AOI Systems) are an ideal
solution for wire bond inspection and measurement.
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